MediaTek’s latest mid-range chipset – the Dimensity 8300 comes with an all big core design and offers the same on-device AI performance as the Snapdragon 8 Gen 3 on paper.
MediaTek today announced the Dimensity 8300, a new mid-range chipset that takes on Qualcomm’s recently launched Snapdragon 7 Gen 3. Similar to the company’s latest flagship – Dimensity 9300, the new chipset brings on-device generative AI capabilities and features an ‘all big-core design’.
Based on TSMC’s 2nd generation 4nm process, the Dimensity 8300 has an octa-core CPU that comprises 4 ARM Cortex-A715 cores accompanied by 4 ARM Cortex-A510 cores. MediaTek says the new chipset offers a 20 per cent performance boost and consumes 30 per cent less power compared to its predecessor.
As for the GPU, the Dimensity 8300 chipset packs the Mali-G615 MC6 GPU which offers 60 per cent increased performance while consuming 55 per cent less power. Like the recently launched Snapdragon 8 Gen 3 chipset, the new MediaTek chipset features a new dedicated APU 780 AI processor that can run generative AI models with up to 10 billion parameters on the device itself.
The company also bumped up the maximum RAM speed support from 6400MHz to 8300MHz, which might translate to a roughly 33 per cent improvement when it comes to multitasking. Compared to the Dimensity 8200, which supports UFS 3.1 storage, the new chipset brings support for the latest standard – UFS 4.0.
Another major improvement is the ability to record 4K videos at 60fps, which is in line with the Snapdragon 7 Gen 3. MediaTek also introduced a new feature that enables users to record 4K HDR videos on two cameras simultaneously, ‘flagship grade video noise reduction’ and an AI-Color Content Smart ISP.
As for gaming, the Dimensity 8300 now features MediaTek’s ‘Adaptive Game Technology 2.0’ as well as Modem Express 2.0, which might help keep the chipset cooler while offering a high FPS lag-free gaming experience.
Coming to the modem, MediaTek says the new processor can reach peak download speeds of up to 5.17Gbps on 5G networks and comes with Wi-Fi 6E support, which increases the bandwidth by 2x compared to the previous generation.
The first phones powered by the Dimensity 8300 chipset are expected to launch sometime in December 2023.
Source:indianexpress.com